Samsung is reportedly weighing the use of either titanium or carbon fiber reinforced plastic (CFRP) for the backplate of next year’s Galaxy Z Fold 8, according to The Elec. According to the report, sources say CFRP was reconsidered as an option due to uncertainties surrounding the U.S.–China ...

As SiCarrier advances chipmaking tools for 5nm production amid China’s semiconductor self-reliance push, Tsinghua University has reportedly achieved a breakthrough in EUV lithography materials. Researchers have developed a new polytellurium oxane-based photoresist, opening up fresh design strategi...

Intel is set to hold its earnings call on July 24, and according to Reuters, these are some key issues to watch ahead of the event. Shift to 14A and Potential Writedown Commentary on Intel’s 14A process will be a key point of interest. According to Reuters, CEO Lip-Bu Tan is prioritizing 14A...

Trump on Wednesday unveiled the long-awaited AI Action Plan, built on three pillars to boost AI development. But key details mentioned—like chip location tracking and new export controls on semiconductor sub-systems—are still up in the air. Here’s a quick breakdown of the major takeaways on AI...

At an AI event in Washington on Wednesday, AMD CEO Lisa Su stated that chips produced at TSMC’s Arizona plant cost “more than 5% but less than 20%” more than those made in Taiwan, according to Bloomberg. She also noted that AMD expects to receive its first batch of chips from the Arizona facil...