With Samsung and SK hynix already entrenched in the high-capacity GDDR7 race, Micron is now the latest heavyweight to enter the arena. According to listings spotted on Micron’s official website and cited by Wccftech, the company has begun rolling out 24Gb (3GB) GDDR7 modules, rated at both 28 GT/s...

Cristiano Amon, CEO of Qualcomm, reportedly arrived in South Korea on April 21 and is scheduled to meet with executives from Samsung Electronics and SK hynix in succession. According to Hankyung, a key focus of his visit may be potential collaboration with Samsung Foundry. He is expected to meet wit...

Apple will end support for Intel-based Macs with its latest operating system, macOS 27. According to EE Times China, citing MacRumors, Apple has officially confirmed that macOS 27, set to roll out in September, will only support devices powered by its in-house M-series chips, fully discontinuing sup...

A magnitude 7.7 earthquake struck off Japan’s northeastern coast on April 20, putting renewed focus on potential disruptions to the semiconductor supply chain, given the region’s concentration of key memory production and chipmaking materials and equipment suppliers. According to ijiwei, Kiox...

Intel is expanding its advanced packaging footprint, as a company backed by Intel Capital is reportedly launching India’s first advanced 3D chip packaging facility. According to The Indian Express, the project—developed by U.S.-based 3D Glass Solutions (3DGS), in which Intel has invested, throug...