Market chatter has been circulating that Samsung Electronics Chairman Jay Y. Lee made a discreet visit to Taiwan last week, reportedly aiming to secure foundry orders for IC design major MediaTek from TSMC. However, at MediaTek’s shareholder meeting on May 29, TechNews and Liberty Times, citing CE...

Huawei's Tau (τ) Scaling Law is attracting growing industry attention as the company pursues a different path toward advancing chip performance. According to TechNews, NVIDIA CEO Jensen Huang commented on Huawei’s newly proposed semiconductor principle, the Tau (τ) Scaling Law, on May 28 during ...

Just months after rolling out HBM4 shipments in early 2026, Samsung has begun providing samples of the industry’s first 12-layer HBM4E to major global partners, according to the company’s latest press release. Given that HBM4 shares the same 1c DRAM process and 4nm base die architecture as HB...

With the ongoing development of AI computing infrastructure, demand across the high-speed optical interconnect supply chain is increasingly extending upstream to equipment vendors. On May 19, MOCVD equipment maker AIXTRON announced that it had secured multiple orders from optical communications c...

Researchers at the Advanced Semiconductor Institute of the Hangzhou International Innovation Center at Zhejiang University recently announced a major breakthrough. A team led by Professor Xiaodong Pi and Researcher Rong Wang successfully fabricated an ultra-thick silicon carbide (SiC) epitaxial film...