As NVIDIA accelerates adoption of SOCAMM2 (Small Outline Compression Attached Memory Module 2), competition among memory heavyweights is intensifying. Following Micron’s shipment of 256GB SOCAMM2 samples in early March, SK hynix announced on April 20 that it has kicked off mass production of 192GB...

Samsung Electro-Mechanics and LG Innotek have reportedly initiated efforts to secure co-packaged optics (CPO) technology. According to ETNews, sources indicate that both companies have accelerated their push to integrate CPO into AI semiconductor substrates. Moving beyond the conceptual stage, they ...

Since April 2026, global semiconductor packaging and testing sector has seen a wave of major developments. ASE has kicked off its largest-ever fab construction program, with six new facilities slated to break ground worldwide this year. Meanwhile, Samsung Electronics plans to invest USD 4 billion in...

Intel has recruited a semiconductor veteran from Samsung. According to Wccftech, citing a LinkedIn post by Intel Executive Vice President Naga Chandrasekaran, Shawn Han has joined Intel as Senior Vice President and General Manager of Foundry Services. He is set to begin the role in May and will repo...

While TSMC has signaled exceptionally strong demand for 3nm and a further reduction in mature-node output at its earnings call, another Taiwanese foundry is moving in the same direction amid tightening supply conditions. According to TechNews, citing a client notice, United Microelectronics Corporat...