As Lam Research announced the establishment of its Panel-Level Packaging Center of Excellence (CoE) in Salzburg, Austria, attention has turned to its customer and partner ecosystem. According to EE Times Japan, Yasumitsu Orii, head of Rapidus’ engineering center, delivered a congratulatory vide...

As global CSPs accelerate efforts to reduce reliance on NVIDIA through custom silicon, ASICs are gaining momentum across the industry, supporting growth prospects for partners such as Alchip. According to Commercial Times, during Alchip’s earnings call on the 26th, Chairman Johnny Shen said that ...

Intel’s glass substrate ambitions appear to be moving closer to commercialization, with speculation growing over the location of its first volume production facility. According to Forbes, Rio Rancho, New Mexico, could become not only Intel’s first site for volume glass substrate manufacturing, b...

As thermal management emerges as a key challenge for HBM, SK hynix has unveiled its iHBM solution, which integrates cooling elements (ICEs) directly into the HBM package. The company plans to adopt the technology in next-generation products, including HBM5, according to its press release. Accordi...

Another traditional Japanese industrial player may be stepping deeper into advanced semiconductor manufacturing. According to Nikkei, adhesive tape company Lintec plans to begin mass production of a dust-proof film used in cutting-edge chip production as early as 2026. The company is expected to inv...