[News] Intel Reportedly Eyes World’s First Glass Substrate Output at Rio Rancho; Offers Silicon Photonics to Customers

Intel’s glass substrate ambitions appear to be moving closer to commercialization, with speculation growing over the location of its first volume production facility. According to Forbes, Rio Rancho, New Mexico, could become not only Intel’s first site for volume glass substrate manufacturing, but potentially the first in the world, as Intel’s glass substrates are currently available only through a pilot line in Chandler.

The report points out that Intel recently began offering silicon photonics manufacturing services to external foundry customers at the Rio Rancho facility. Wccftech adds that Intel’s first glass substrate prototypes featuring co packaged optics (CPO) were recently unveiled, with commercialization expected by 2030.

EMIB Gains Traction as Intel Expands Packaging Ecosystem

Intel is reportedly seeing growing customer interest in its EMIB advanced packaging technology. According to Forbes, citing channel sources, AWS and Cisco are existing customers of Intel Foundry’s advanced packaging services, while Apple, Google, Microsoft, Nvidia, and Tesla are said to be in talks over potential collaborations. The report further notes that facilities in Penang, Malaysia, and Rio Rancho handle most of Intel’s EMIB (Embedded Multi-die Interconnect Bridge) production for 2.5D packaging, as well as Foveros 3D die stacking.

In addition, Intel Foundry has established strategic partnerships with SK hynix on HBM memory and with Amkor Technology. The report notes that Amkor is expanding capacity in Arizona, likely to support new local fabs from Intel and TSMC.

Global Race to Commercialize Glass Substrates Accelerates

As Wccftech notes, substrate shortages driven by the AI supercycle have prompted Ajinomoto, one of the industry’s largest suppliers, to raise prices. The supply pressure is pushing the industry toward new advanced packaging solutions, with glass substrates emerging as a potential alternative.

According to TrendForce on Substack, continued use of organic core substrates for large packages, primarily ABF materials made by laminating resin, glass fiber cloth, and copper foil, can worsen warpage during the reflow heating process and reduce integration yields. As a result, glass has emerged as an attractive alternative for interposers or substrates due to its flat surface and coefficient of thermal expansion (CTE), which is closer to that of silicon (Si).

Beyond Intel, global companies are accelerating glass substrate development. According to Business Post, SKC and its subsidiary Absolics are expected to begin what could become the world’s first commercial production of glass substrates by the end of this year. Meanwhile, The Elec reports that Samsung Electro-Mechanics is operating a glass substrate pilot line at its Sejong plant in South Chungcheong Province, targeting mass production after 2027.

Chinese companies are also stepping up efforts. As noted by ETNews, Chinese display panel maker BOE is partnering with U.S. company Corning to accelerate future growth businesses, including glass substrates, optical communications, and perovskites.

Read more

• Glass Substrates Are Breaking Through the AI Chip Packaging Bottleneck
• [News] SKC Said to Speed Glass Substrate Mass Production by Year-End; Advances New Non-Embedding Tech for U.S. Client
• [News] Intel Says EMIB Customers Back Substrate Prepayments; 4 Taiwan, 2 Japan Suppliers Seek Commitments

(Photo credit: Intel)