Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, citing Weibo tipster Fixed Focus Digital, Apple may shift from InFO (Integrated Fan-Out) to WMCM (Wafer-level Multi-Chip Module) packaging for its A20...

Meta is advancing its push into AR glasses, with South Korean component suppliers reportedly poised to benefit. According to Business Korea, citing sources, South Korea’s Sapien Semiconductors is expected to supply backplanes—chips that control Micro LED pixels—for Meta’s Micro LED (LEDoS)-b...

As AI demand accelerates, companies are ramping up efforts to address rising AI-server power needs. According to MoneyDJ, citing Nikkei, Murata Manufacturing plans to begin mass production of power modules for AI servers in 2026. The company is coordinating with hyperscalers and expects to generate ...

As SEMICON Japan opens today (December 17), Nikkei reports that semiconductor heavyweights—including NVIDIA, Intel, Micron, and TSMC—are set to participate. Yet the biggest buzz may center on Rapidus, the Japanese foundry expected to unveil the world’s first interposer prototype cut from a sin...

Apple is entering the race to develop in-house AI chips. According to Economic Daily News, citing sources, the company is working with Broadcom to develop its first proprietary AI chip, dubbed “Baltra,” with AI servers deployment expected to begin in 2027. The move aims to further advance Apple ...