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2025-11-27

[News] Intel Stands Firm on Lo Hire Amid TSMC Trade Secret Dispute: CEO Vows Support, Dismisses Claims

Amid controversy over former TSMC SVP Wei-Jen Lo joining Intel amid sub-2nm trade secret claims, Team Blue has finally spoken out. Oregon Live reports that CEO Lip-Bu Tan reassured employees Wednesday that the company acted responsibly in hiring Lo, pushing back against the new lawsuit from the Taiw...

2025-11-27

[News] GlobalFoundries Moves on GaN: TSMC and Navitas Ties Position U.S. as New GaN Production Hub

As TSMC signals its exit from Gallium Nitride (GaN) wafer foundry services by 2027, another semiconductor powerhouse is seizing the opportunity. GlobalFoundries is accelerating its GaN initiatives, with moves that, according to EE Times, could establish it as a key U.S. hub for GaN fabrication. O...

2025-11-27

[News] 64GB DDR5 RAM Reportedly Now Pricier Than a PlayStation 5 Amid Soaring Memory Costs

Driven by explosive AI demand, memory prices are climbing at a pace the industry hasn’t seen in years. According to TechNews, citing PCMag, PC RAM costs have surged sharply, with a 64GB DDR5 kit now topping $500, which is more expensive than a Sony PlayStation 5. The report notes that, compared...

2025-11-26

[News] Beyond Ex-VP Lo, Intel Is Reportedly Poaching TSMC Arizona Engineers With 20–30% Higher Salaries

Former TSMC senior vice president Wei-Jen Lo’s move to Intel—along with allegations that he took sub-2nm documents—has now sparked reports that Intel is also trying to recruit TSMC engineers in Arizona. According to Liberty Times, sources say Intel has recently been aggressively poaching engin...

2025-11-26

[News] South Korea’s HBM Lead Reportedly Under Strain as TSMC and Adeia Dominate Hybrid Bonding IP

South Korean leaders Samsung and SK hynix dominate the HBM space, but there is one area where their position appears less secure. According to The Elec, a new analysis from the Korea Institute of Intellectual Property Promotion (KIPRO) finds that most key patents for HBM-related advanced packaging ...

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