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2026-01-22

[News] Apple Reportedly Eyes 2027 AirTag-Sized AI Wearable Launch to Compete With OpenAI

Apple is reportedly working on a new wearable device. According to 9to5Mac, citing The Information, sources say Apple is developing an AI wearable roughly the size of an AirTag, with a possible launch as early as 2027. However, the report cautions that development remains at a very early stage and t...

2026-01-22

[News] Samsung Accelerates Taylor Fab Ramp-Up, Domestic EUV Pellicles Reportedly Enter U.S. Line

Samsung is accelerating the ramp-up of its Taylor fab, with trial runs of extreme ultraviolet (EUV) lithography tools reportedly beginning as early as March. Adding to the momentum, ETNews reports that the company has awarded a KRW 25 billion contract to South Korean supplier FST for EUV pellicle ha...

2026-01-22

[News] World’s First Gen-8.6 OLED Production Line Enters Mass Production and Begins Shipments

As per Chosun Ilbo, Samsung Display has officially achieved mass production of Gen-8.6 OLED panels, marking the world’s first production line of its kind to reach commercial output. Sources indicate that Samsung Display has already begun paid shipments of customer-validated samples with relatively...

2026-01-22

[News] Vietnam Breaks Ground on First Domestic Chip Plant, Reportedly Aims Trial Production by 2027

Long known as a hub for electronics assembly, Vietnam has so far lacked upstream chip manufacturing. However, this is beginning to shift. On January 16, military-run Viettel Group broke ground on the country’s first domestic semiconductor plant, marking a major step toward a self-sufficient chip i...

2026-01-21

[News] Samsung Reportedly Moves Custom HBM Logic Die to 2nm Foundry Process for the First Time

Samsung is stepping up its development of custom HBM logic dies. According to ZDNet, sources say the company is designing logic dies for custom HBM using foundry process nodes as advanced as 2nm. The report adds that Samsung Electronics previously applied a 4nm process to the logic die used in HBM4 ...

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