Earlier in July, Intel announced plans to consolidate its chip packaging operations in Costa Rica with facilities in Vietnam and Malaysia amid operational challenges. However, facing surging demand for chip packaging, the company is now set to inject an additional RM860 million ($208 million) into M...

Buzz is building as tech giants like Google and Meta consider Intel’s EMIB advanced packaging, and Team Blue is going full throttle. ETNews reports that Intel is understood to have established its EMIB process at Amkor's Songdo K5 facility in South Korea—its first-ever move to outsource such hig...

As memory makers push deeper into custom HBM logic dies for the HBM4 era, foundries—led by TSMC—are stepping up with more breakthroughs. German outlet HardwareLUXX reports that TSMC’s custom HBM4E, currently dubbed C-HBM4E, will leap to the N3P node. Along with dropping voltage from 0.8 V to 0...

Intel is gaining momentum, reportedly locking in major orders from tech giants amid backing from Washington and NVIDIA, boosting market confidence. According to Tom’s Hardware and Commercial Times, Apple is eyeing Intel’s 18A node for M-series chips as soon as 2027, while MediaTek is exploring E...

On November 21, the European Commission officially approved a state aid measure for the Czech Republic, authorizing a direct grant of approximately Euro 450 million to onsemi, specifically supporting the company’s next-generation silicon carbide (SiC) power device integrated manufacturing facility...