Subject


IC Manufacturing, Package&Test


2025-12-09

[News] Samsung Reportedly Speeds Up U.S. Hiring as Tesla Prepares for AI5 Production

IC Manufacturing, Package&Test

With major orders secured, Samsung is accelerating preparations for seamless U.S. production. According to Sedaily, the company’s Device Solutions Americas division is hiring veteran engineers for its Customer Engineering (CE) team to resolve complex foundry challenges, stabilize yields, and ensur...

2025-12-09

[News] Over CNY 10 Billion is Poured into China’s Integrated Circuit Sector

IC Manufacturing, Package&Test

In recent weeks, China’s semiconductor industry has seen a hike in major capital investment into Integrated Circuit (IC) sector. Shanghai IC Industry Investment Fund Phase II Raises Capital to CNY 24.06 Billion, Up ~66% Corporate registry data shows that the Shanghai Integrated Circuit Indus...

2025-12-08

[News] TSMC’s CoWoS-L/ S Reportedly Fully Booked, OSAT Partners Step up with ASE’s CoWoP in Focus

IC Manufacturing, Package&Test

Amid heightened attention on Intel’s EMIB (Embedded Multi-die Interconnect Bridge), TSMC is experiencing exceptionally strong demand for its own advanced packaging. According to Economic Daily News, a surge of AI and HPC orders from NVIDIA, Google, Amazon, and MediaTek has driven TSMC’s entire C...

2025-12-08

[News] Tokyo Electron Sees AI-Driven Sales Hitting 40% by FY2026, Offsetting China Slowdown

IC Manufacturing, Package&Test

U.S. export controls are hitting global chip-tool makers, and Tokyo Electron (TEL) is scrambling to make up for shrinking orders from China. According to a recent interview with Nikkei, Executive Managing Director for finance Hiroshi Kawamoto says that by fiscal 2026, the company’s equipment for a...

2025-12-05

[News] Inside Huawei’s Patent Playbook: GPU Dominance and Sub-2nm Ambitions Under Sanctions

IC Manufacturing, Package&Test

As China accelerates its push for semiconductor self-sufficiency, all eyes are on how leading tech firms are advancing cutting-edge technologies under U.S. sanctions, with Huawei clearly at the forefront. According to Nikkei, the Chinese chip giant has dramatically ramped up GPU-related patent filin...

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