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IC Manufacturing, Package&Test


2025-07-11

[News] Tariff Uncertainty Could Put Malaysia’s Chip Expansion on Ice

IC Manufacturing, Package&Test

With Trump warning a couple of days ago that Malaysia could face a separate 25% tariff starting August 1, chipmakers in the country are hitting pause on investments as they await clarity on U.S. tariffs, according to Bloomberg. Citing remarks from Malaysia Semiconductor Industry Association presi...

2025-07-11

[News] Is the GaN Foundry Model Facing Trouble? China’s Innoscience Weighs In as TSMC Plans 2027 Exit

IC Manufacturing, Package&Test

While TSMC plans to exit the gallium nitride (GaN) wafer foundry business by 2027, industry heavyweight Infineon is ramping up its efforts—signaling a notable shift within the GaN sector. What factors might be driving these diverging strategies? According to a report from STAR Market Daily, Board ...

2025-07-10

[News] Intel’s Harsh Wake-Up Call: CEO Reportedly Says It’s No Longer a Top 10 Chipmaker

IC Manufacturing, Package&Test

While rolling out a fresh wave of layoffs—reportedly cutting over 500 Oregon jobs by July 15 as part of broader plans to cut 15–20% of manufacturing roles—Intel CEO Lip-Bu Tan bluntly told employees he no longer sees Intel as a leading chipmaker, not even in the top 10, according to Oregon Liv...

2025-07-10

[News] TSMC Reportedly to Break Ground on U.S. Advanced Packaging Plants in 2028, Starting with SoIC

IC Manufacturing, Package&Test

As TSMC accelerates its U.S. expansion with progress on its third Arizona fab, it still has to ship cutting-edge chips—like those for NVIDIA—back to Taiwan for advanced packaging. But that’s set to change. According to MoneyDJ, the foundry giant plans to break ground on two advanced packaging ...

2025-07-10

[News] Cadence to Expand Collaboration with Samsung Foundry

IC Manufacturing, Package&Test

On July 8, Cadence officially announced via its WeChat account that the U.S.-based company has recently decided to expand its collaboration with Samsung Foundry. The two parties have signed a new multi-year IP agreement to extend the deployment of Cadence® memory and interface IP solutions on Samsu...

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