[News] TSMC Reportedly to Break Ground on U.S. Advanced Packaging Plants in 2028, Starting with SoIC

As TSMC accelerates its U.S. expansion with progress on its third Arizona fab, it still has to ship cutting-edge chips—like those for NVIDIA—back to Taiwan for advanced packaging. But that’s set to change. According to MoneyDJ, the foundry giant plans to break ground on two advanced packaging plants in the U.S. in 2028, featuring SoIC (System-on-Integrated-Chips) and CoPoS (Chip-on-Panel-on-Substrate) technologies.

While Liberty Times previously reported that site selection is still under review, MoneyDJ says the facilities are expected to be built next to the third Arizona fab (F21 P3), which will feature N2 and A16 process technologies.

Interestingly, TSMC’s U.S. packaging plants probably won’t start with the in-demand CoWoS (Chip on Wafer on Substrate), but with SoIC and CoPoS, according to MoneyDJ.

Since SoIC is more mature—already in mass production with AMD and expected to be adopted by Apple, NVIDIA, and Broadcom for future high-end products—the report indicates TSMC plans to scale it up first in the U.S. On the other hand, CoPoS will follow at a second plant, aimed at meeting post-2030 demand, the report adds.

However, Taiwan will remain at the forefront of TSMC’s advanced packaging push, with the first CoPoS pilot line set for 2026 and mass production planned at the upcoming Chiayi site (AP7) between late 2028 and 2029, the report says.

Read more

• [News] U.S. Senate Reportedly Eyes 35% Tax Credit for New Chip Fabs, Boosting TSMC, Intel and Samsung
• [News] TSMC’s 2nd Arizona Fab Reportedly to Install 3nm Gear in 3Q26, U.S. Price Hikes Likely over 10% Next Year

(Photo credit: TSMC)