Ahead of TSMC’s earnings call later this week, the spotlight is once again on its advanced packaging roadmap—and CoWoS is no longer the only story. According to Commercial Times, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot line has already begun tool deliveries to R&D teams in February...

TSMC is scheduled to hold a media tour in Chiayi on the 22nd, marking the first time its Chiayi AP7 site will be opened to local media. According to Commercial Times, construction at TSMC’s Chiayi facilities is progressing at full speed. Supply-chain sources note that AP7 Plant 2 began equipment i...

TSMC has been actively expanding its advanced packaging capacity. According to MoneyDJ, the company held an opening ceremony for its AP7 facility in Chiayi, Taiwan, on the 4th. Supply chain sources note that Phase 2 of AP7 has recently begun equipment installation and testing, with production expect...

As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in Arizona, with construction set to begin in 2H26 and production by 2028. The report also details TSMC...