NVIDIA’s GTC revealed plans to launch an enhanced Rubin Ultra in 2027, while its next-generation architecture, Feynman, is also coming into view for 2028. According to Commercial Times, SoIC (System on Integrated Chips) is expected to be a key technology for TSMC to meet customer design needs for ...

NVIDIA’s GPUs and SK hynix’s HBM currently dominate the AI computing landscape. But the industry is already looking beyond HBM as new memory technologies emerge to address the growing bottleneck of data movement. According to South Korean outlet Global Economic News, as large-scale AI models exp...

TSMC has been actively expanding its advanced packaging capacity. According to MoneyDJ, the company held an opening ceremony for its AP7 facility in Chiayi, Taiwan, on the 4th. Supply chain sources note that Phase 2 of AP7 has recently begun equipment installation and testing, with production expect...

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in Arizona, with construction set to begin in 2H26 and production by 2028. The report also details TSMC...

As TSMC accelerates its U.S. expansion with progress on its third Arizona fab, it still has to ship cutting-edge chips—like those for NVIDIA—back to Taiwan for advanced packaging. But that’s set to change. According to MoneyDJ, the foundry giant plans to break ground on two advanced packaging ...