The demand for AI computing power is skyrocketing, with advanced packaging capacity becoming key. As per a report from Commercial Times citing industry sources, it has pointed out that TSMC is focusing on the growth potential of advanced packaging. Southern Taiwan Science Park, Central Taiwan Sci...

Apple currently uses TSMC's 3-nanometer process for multiple chipsets. According to a report from wccftech, the iPhone 17 chipset will not adopt the 2-nanometer process. Instead, the A19 Pro chip, expected in 2025, is reportedly maintaining the 3-nanometer technology. The same report suggests tha...

Amid NVIDIA's leadership in the AI wave, demand for CoWoS (Chip-on-Wafer-on-Substrate) has tripled, driving TSMC to aggressively expand CoWoS capacity, with a corresponding surge in demand for System-in-Integrated-Circuit (SoIC) solutions. According to a report from MoneyDJ citing industry source...

With AI demand exploding across the board, TSMC initiated a major expansion plan for CoWoS in 2023. According to MoneyDJ citing sources, TSMC reportedly initiated a new wave of orders to Taiwan-based equipment manufacturers this month. Delivery is expected in the fourth quarter of this year. Ther...

In the surge of AI advancements, a CoWoS expansion wave is rapidly underway, with TSMC showcasing ongoing ambitions in advanced packaging. According to MoneyDJ, recent industry reports suggest that TSMC is revising upward its capacity plans for SoIC (System-on-Integrated-Chips). By the end of thi...