Despite concerns that TSMC’s growing investments in the U.S. might affect its operations in Taiwan, a report from MoneyDJ, citing industry sources, suggests otherwise. Instead of slowing down, TSMC is accelerating the expansion of its advanced packaging capacity within Taiwan. The report highlight...

As TSMC preps for 2nm mass production in the second half of 2025, it is also accelerating advanced packaging expansion to meet strong demand, with a shifting focus beyond CoWoS. According to Commercial Times, NVIDIA’s next-gen Rubin GPU will join AMD and Apple in adopting TSMC’s SoIC (System on ...

A previous report from Economic Daily News once reported that, Innolux is set to sell its 4th Plant in Tainan (5.5-generation LCD panel plant), which was closed in 2023. Moreover, the report has cited rumors in the market, claiming that both Micron and TSMC have been actively exploring the acquisi...

According to a report from Economic Daily News, TSMC's advanced packaging platform SoIC is said to have secured another heavyweight customer, with Apple expected to adopt the technology in 2025. If confirmed, Apple will join AMD as a major client expanding its use of TSMC's SoIC . TSMC has categ...

With the flourishing of AI applications, two major AI giants, NVIDIA and AMD, are fully committed to the high-performance computing (HPC) market. It's reported by the Economic Daily News that they have secured TSMC's advanced packaging capacity for CoWoS and SoIC packaging through this year and the ...