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IC Manufacturing, Package&Test


2026-03-10

[News] ROHM Secures GaN Technology License from TSMC, to Build Production Line by 2027

IC Manufacturing, Package&Test

Recently, ROHM announced that it will integrate its own R&D and manufacturing expertise in gallium nitride (GaN) power devices with the process technologies of long-term partner TSMC. The company plans to establish a dedicated production system at its Hamamatsu facility by 2027 to meet surging d...

2026-03-09

[News] Samhwa Paint Enters Semiconductor Materials with Melt Master Batch in Samsung AP Packaging

IC Manufacturing, Package&Test

Riding the semiconductor surge, traditional industries are racing to pivot into the booming sector. South Korea’s paint giant, Samhwa Paint Industries, announced on March 6 that, in partnership with Samsung SDI, it has successfully developed high-performance MMB (Melt Master Batch), a key material...

2026-03-04

[News] Asia’s Chipmakers Reportedly Eye $136B Spend in 2026, Up 25% YoY, Spanning Foundry and Memory

IC Manufacturing, Package&Test

Fueled by soaring demand for AI chips, memory, and logic processors, Asia’s top chipmakers are ramping up their 2026 capital spending. Nikkei and TrendForce report that leading semiconductor firms across South Korea, Taiwan, Japan, and China plan to invest over $136 billion this year, a 25% increa...

2026-03-03

[News] Delay at Samsung’s Taylor Reportedly Slips Mass Production to 2027, Raising Concerns for Tesla

IC Manufacturing, Package&Test

As Samsung accelerates fab approvals and equipment installations, questions are emerging about the pace of mass production at the Taylor plant. Korea JoongAng Daily reports that the start of full-scale production at Samsung’s Texas facility is now expected to slip to early 2027. If confirmed, t...

2026-03-03

[News] Intel Unveils Xeon 6+ Clearwater Forest at MWC with 18A Chiplet Design and Foveros Direct 3D

IC Manufacturing, Package&Test

Just weeks after unveiling Panther Lake at CES in January, Intel returned to the spotlight at MWC 2026 with the Xeon 6+ “Clearwater Forest,” showcasing the progress of 18A. According to TechPowerUp, the processor features one of Intel's most advanced chiplet designs yet: the package combines 12 ...

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