Please note that this article cites information from Reuters, ijiwei, EE News Analog, and STMicroelectronics. STMicroelectronics has taken a major step to meet China’s growing chip demand. Reuters, citing a company press release, reports that the European chipmaker began shipping STM32 wafers t...

Please note that this article cites information from CNBC, Liberty Times, TechNews, Maeil Business, Hankyung and Solution News. The Middle East war, widely known for driving oil prices up, is also threatening the semiconductor industry by hitting a critical yet little-known resource: helium. As r...

Please note that this article cites information from The Elec. Rumors have recently resurfaced that lithography leader ASML is evaluating entry into the back-end semiconductor equipment market, targeting the fast-growing advanced packaging segment. According to Korean media outlet The Elec, ASML ha...

Please note that this article cites information from Nikkei and Rix. As semiconductor giants like TSMC accelerate development and capacity expansion for 2.5D and 3D packaging technologies such as CoWoS, a new business opportunity is emerging for chipmaking tool companies. According to Nikkei, Jap...

As industry buzz grows over Intel’s potential role in advanced packaging for NVIDIA’s next-gen Feynman GPUs at GTC 2026, eyes are on its EMIB (Embedded Multi-die Interconnect Bridge) technology and expanding Malaysia operations. According to The Edge Malaysia, the chipmaker’s advanced packagin...