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2026-06-05

[Insights] Early June Panel Prices: TV Demand Weakens; MNT Price Gains Lose Momentum, NB Stays Flat

.TV Entering June, TV panel demand is beginning to show signs of easing as inventory build-up for 618 shopping festival and FIFA World Cup-related promotions gradually winds down, while preparations for year-end promotional campaigns have yet to begin. Panel makers have also started to feel sof...

2026-06-05

[News] HBF Spurs Equipment Race; Hanmi Semiconductor Eyes First TC Bonder Deliveries in 2H26

Back-end semiconductor equipment suppliers are increasingly focusing on High Bandwidth Flash (HBF), a next-generation memory technology designed for AI inference. According to ZDNet, industry sources said that South Korean and international back-end equipment makers have begun developing thermal com...

2026-06-05

[News] SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion

SK hynix is reportedly preparing a major DRAM capacity expansion. According to The Elec, the company has shared plans with key suppliers to nearly double its DRAM wafer production capacity by 2030–2031 from current levels. The plan aligns with comments made by SK Group Chairman Chey Tae-won at Co...

2026-06-05

[News] Motherboard and Module Makers Reportedly Expand DDR4 Platforms Amid Rising DDR5 Costs

Several vendors are reportedly ramping up DDR4 production as demand remains strong. According to Wccftech, higher DDR5 prices are contributing to stronger demand for DDR4 platforms. While DDR4 prices have also increased, they remain significantly lower than those of comparable DDR5 modules. The repo...

2026-06-05

[News] Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows

As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate solutions, with glass substrates emerging as a focal point. According to Sisa Journal, the technology is expected to begin early commercialization in 2027, move through a ramp-up phase ...

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