[News] HBF Spurs Equipment Race; Hanmi Semiconductor Eyes First TC Bonder Deliveries in 2H26

Back-end semiconductor equipment suppliers are increasingly focusing on High Bandwidth Flash (HBF), a next-generation memory technology designed for AI inference. According to ZDNet, industry sources said that South Korean and international back-end equipment makers have begun developing thermal compression (TC) bonders for HBF manufacturing.

While the ultimate market potential of HBF remains uncertain, the report indicates that TC bonder suppliers could be among the first beneficiaries if the technology reaches commercial production. TC bonders are used to stack and connect memory devices using heat and pressure.

Major back-end equipment suppliers have already entered the race to develop HBF-related equipment. According to the report, Hanmi Semiconductor and Hanwha Semitech are seeking positions in the emerging supply chain in South Korea, while players such as ASMPT and Kulicke & Soffa (K&S) are also working to establish a foothold in the market.

Notably, Hanmi Semiconductor appears to be leading the field. The report notes that the company is preparing to deliver its first batch of HBF TC bonders to customers in the second half of 2026 and is viewed as being furthest along in development.

Industry sources said the core technical architecture of TC bonders for HBM and HBF is largely the same, meaning existing platforms could likely be adapted through customization. While HBF standards have yet to be finalized, bonding pitch requirements are expected to be less stringent than those of HBM, potentially reducing technical complexity.

However, the report notes that precise control of heat and pressure remains a critical challenge. Because NAND flash is more susceptible to heat and pressure than DRAM, manufacturers must minimize cracking during the TC bonding process when producing HBF.

SanDisk Leads HBF Standardization, Advances Commercialization Efforts

As the report highlights, SanDisk is leading HBF standardization and development efforts. The company plans to release its first HBF samples in the second half of 2026, followed by AI chip-integrated samples in early 2027. The first-generation product is expected to feature a 16-layer NAND stack. SK hynix is also working with SanDisk on standardization efforts and related technology development.

SanDisk is also stepping up collaboration with equipment suppliers. According to an April report by The Bell, the company is working with South Korean equipment makers on HBF sample development. Sources said that a supplier holding a monopoly position in equipment for HBM production was planning to provide sample equipment to SanDisk around early summer 2026.

Read more

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• [News] SanDisk Reportedly Eyes 2H26 HBF Pilot Line; May Advance Previously Announced Timeline by Half a Year

(Photo credit: SanDisk)