[News] Samsung Plans to Introduce 3D HBM Chip Packaging Service in 2024

2024-06-17 Semiconductors ChloeWang

In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and processors needed for high-performance chips, in much smaller sizes. Now, at the Samsung Foundry Forum in San Jose taken place in June, the tech giant made it public that it would introduce 3D packaging services for HBM within this year, according to the latest report by The Korea Economic Daily.

For now, HBM chips are predominantly packaged with 2.5D technology. Citing industry sources as well as personnel from Samsung, the company’s 3D chip packaging technology is expected to hit the market for HBM4, the sixth generation of the HBM family.

Samsung’s announcement regarding its 3D HBM packaing roadmap has been made after NVIDIA CEO Jensen Huang revealed Rubin at COMPUTEX 2024, the company’s upcoming architecture of its AI platform after Blackwell. The Rubin GPU will reportedly feature 8 HBM4, while the Rubin Ultra GPU will come with 12 HBM4 chips, targeting to be released in 2026.

Currently, Samsung’s SAINT (Samsung Advanced Interconnect Technology) platform includes three types of 3D stacking technologies: SAINT S, SAINT L, and SAINT D.

SAINT S involves vertically stacking SRAM on logic chips such as CPUs, while SAINT L involves stacking logic chips on top of other logic chips or application processors (APs). SAINT D, on the other hand, entails vertical stacking of DRAM with logic chips like CPUs and GPUs.

The Korea Economic Daily noted that unlike 2.5D technology, under which HBM chips are horizontally connected with a GPU on a silicon interposer, by stacking HBM chips vertically on top of a GPU, 3D packaging could further accelerate data learning and inference processing, and thus does not require a silicon interposer, a thin substrate that sits between chips to allow them to communicate and work together.

It is also understood that Samsung plans to offer 3D HBM packaging on a turnkey basis, according to the Korea Economic Daily. To achieve this, its advanced packaging team will vertically interconnect HBM chips produced by its memory business division, with GPUs assembled for fabless companies by its foundry unit, the report noted.

Regarding Samsung’s long-time rival, TSMC, the company’s Chip on Wafer on Substrate (CoWoS) has been a key enabler for the AI revolution by allowing customers to pack more processor cores and HBM stacks side by side on one interposer. TSMC also made similar announcement in May, reportedly utilizing 12nm and 5nm process nodes in manufacturing HBM4, according to a report by AnandTech.

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(Photo credit: Samsung)

Please note that this article cites information from The Korea Economic Daily and AnandTech.


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