Subject


HBM4


2026-06-23

[News] Memory Giants Split on HBM4 Strategy: Samsung HBM4 Sales Reportedly Tops $1B, SK hynix Slows Ramp

As memory giants accelerate their next-generation HBM race, Samsung Electronics has reportedly hit a key milestone. According to Yonhap News and ZDNet, its HBM4 has surpassed US$1 billion in revenue, making it the first product in the industry to reach the level just four months after entering mass ...

2026-06-22

[News] Micron Earnings Preview: Four Key Areas in Focus — HBM Progress, Capex and More

As Micron prepares to report its fiscal third-quarter results on June 24, investor attention is turning to whether its strong earnings and elevated margins can be sustained, and how long the ongoing memory rally can support its growth story in DRAM and HBM. Here are four key areas to watch in the up...

2026-06-09

[News] SK hynix Reportedly Places 44.2bn Won TC Bonder Order with Hanmi, Accelerating HBM4 Ramp-up

Following Jensen Huang’s push for higher HBM supply from SK hynix, the memory maker has taken another step to ramp up production. According to ET News, SK hynix has placed a 44.2 billion won order with Hanmi Semiconductor for TC (thermal compression) bonders used in sixth-generation HBM (HBM4) pro...

2026-06-08

[News] SK hynix to Supply Memory for NVIDIA Vera CPU as Partnership Deepens; Samsung Meeting in Spotlight

Following confirmation that the “big three” memory makers—Samsung Electronics, SK hynix, and Micron—have secured HBM4 supply approval for NVIDIA’s Vera Rubin, NVIDIA and SK hynix further deepened their collaboration. As highlighted by Global Economic News, SK hynix’s high-performance mem...

2026-05-29

[News] Samsung Starts Shipping Industry-First HBM4E Samples 3 Months After HBM4 Ramp; Performance Up 20%+

Just months after rolling out HBM4 shipments in early 2026, Samsung has begun providing samples of the industry’s first 12-layer HBM4E to major global partners, according to the company’s latest press release. Given that HBM4 shares the same 1c DRAM process and 4nm base die architecture as HB...

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