[News] Reports Suggest SK Hynix to Establish Advanced Packaging Facility in the US

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According to sources cited by the Financial Times, South Korean chip manufacturer SK Hynix is reportedly planning to establish a packaging facility in Indiana, USA. This move is expected to significantly advance the US government’s efforts to bring more artificial intelligence (AI) chip supply chains into the country.

SK Hynix’s new packaging facility will specialize in stacking standard dynamic random-access memory (DRAM) chips to create high-bandwidth memory (HBM) chips. These chips will then be integrated with NVIDIA’s GPUs for training systems like OpenAI’s ChatGPT.

Per one source close to SK Hynix cited by the report, the increasing demand for HBM from American customers and the necessity of close collaboration with chip designers have deemed the establishment of advanced packaging facilities in the US essential.

Regarding this, SK Hynix reportedly responded, “Our official position is that we are currently considering a possible investment in the US but haven’t made a final decision yet.”

The report quoted Kim Yang-paeng, a researcher at the Korea Institute for Industrial Economics and Trade, as saying, “If SK Hynix establishes an advanced HBM memory packaging facility in the United States, along with TSMC’s factory in Arizona, this means Nvidia can ultimately produce GPUs in the United States.”

Previously, the United States was reported to announce substantial chip subsidies by the end of March. The aim is to pave the way for chip manufacturers like TSMC, Samsung, and Intel by providing them with billions of dollars to accelerate the expansion of domestic chip production.

These subsidies are a core component of the US 2022 “CHIPS and Science Act,” which allocates a budget of USD 39 billion to directly subsidize and revitalize American manufacturing.

Read more

• [News] TSMC Reportedly Announcing Kumamoto Plant 2 in Japan, while U.S. Subsidies Expected by End of March
• [News] Subsidies from the U.S. Legislation “NAPMP” Potentially Expected to Cover IC Substrates

(Photo credit: SK Hynix)