As memory giants enter the final stage of HBM4 ramp-up ahead of NVIDIA’s Rubin launch, they are taking diverging approaches. According to Chosun Biz, Samsung is pushing to lift 1c DRAM yields for HBM4 toward 80%, while ZDNet reports that SK hynix is set to cut HBM4 volumes this year by 20–30%. ...

As memory emerges as a critical bottleneck in hyperscalers’ in-house AI chip development and large-scale infrastructure buildouts, long-term supply agreements are rapidly becoming the new industry standard—on time horizons longer than previously anticipated. According to Aju News, Samsung and SK...

While Iran and the U.S. have agreed to a ceasefire contingent on guaranteed safe passage through the Strait of Hormuz, the helium crisis across the semiconductor supply chain shows temporary signs of easing. However, as highlighted by Forbes, Qatar’s Ras Laffan Industrial City, which supplies r...

As memory giants accelerate the phase-out of legacy NAND like MLC, they are doubling down on next-generation, high-performance storage to ride the AI wave. On April 8, SK hynix announced it has begun shipping its latest cSSD, PQC21 — the first in the industry to feature 321-layer QLC NAND flash. ...

Samsung has reportedly resolved a key technical challenge in its SOCAMM2 design. According to ETNews, citing sources, the company has overcome the “warpage” issue, a major hurdle ahead of mass production of its next-generation AI server memory module, SOCAMM2 (System on Chip Advanced Memory Modu...