As next-gen memory tech like HBM, SOCAMM, and 3D NAND increasingly need stronger chip design and advanced packaging capabilities, SK hynix, according to The Elec, has launched an unusually large-scale recruitment of design engineers. According to the report, the memory giant plans to hire a tripl...

Just weeks after Samsung delivered its first HBM4E samples in May, SK hynix has quickly followed suit. According to a company announcement, the HBM leader has begun shipping 12-high HBM4E samples to major customers, signaling that the race toward next-generation AI memory commercialization is accele...

As Kioxia briefly saw its market capitalization exceed ¥50 trillion on June 16—becoming only the second Japanese firm to reach that level—focus has turned to whether the NAND upcycle can sustain its momentum. Notably, Global Economic News, citing Nikkei, reports that the company is taking a mor...

Samsung announced the start of HBM4E sampling in late May and later unveiled an HBM5 mock-up for the first time at COMPUTEX 2026. Against this backdrop, rival SK hynix is also stepping up its next-generation HBM push, with South Korean media outlet Newsis reporting that the memory giant has secured ...

As SK hynix reportedly targets mass production of 375-layer NAND by year-end, according to The Elec, the 400-layer threshold is increasingly seen as a key technical frontier in advanced NAND scaling. Against this backdrop, ET News notes that Samsung began mass producing its 286-layer NAND in Apri...