While SK hynix had only last week outlined plans to double capacity over the next five years, the memory giant is now signaling an even more aggressive expansion across both DRAM and NAND. According to Nikkei, citing Chairman Chey Tae-won, the company is targeting a threefold increase in wafer outpu...

Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plans to build an advanced packaging plant in Gwangju. Samsung Electronics is expected to announce the investment as early as the end of this month at a mee...

Following Jensen Huang’s push for higher HBM supply from SK hynix, the memory maker has taken another step to ramp up production. According to ET News, SK hynix has placed a 44.2 billion won order with Hanmi Semiconductor for TC (thermal compression) bonders used in sixth-generation HBM (HBM4) pro...

Following confirmation that the “big three” memory makers—Samsung Electronics, SK hynix, and Micron—have secured HBM4 supply approval for NVIDIA’s Vera Rubin, NVIDIA and SK hynix further deepened their collaboration. As highlighted by Global Economic News, SK hynix’s high-performance mem...

SK hynix is reportedly preparing a major DRAM capacity expansion. According to The Elec, the company has shared plans with key suppliers to nearly double its DRAM wafer production capacity by 2030–2031 from current levels. The plan aligns with comments made by SK Group Chairman Chey Tae-won at Co...