While Samsung Electronics and SK hynix showcase HBM5 and HBM4E respectively at COMPUTEX Taipei, competition among memory giants is increasingly centering on thermal management. As reported by The Asia Business Daily, Samsung, SK hynix, and Micron are placing greater emphasis on cooling and power-eff...

Shortly after touring SK hynix’s COMPUTEX booth in Taipei alongside NVIDIA CEO Jensen Huang on June 2, SK Group Chairman Chey Tae-won met with TSMC Chairman C.C. Wei for the first time in two years, according to a post by SK hynix on its official X account on June 4. Hankyung adds that the meeting...

As next-gen HBM solutions has become a key focus at COMPUTEX amid surging AI demand, SK Group Chairman Chey Tae-won made a brief visit to the SK hynix booth on June 2 and spoke with the media. According to TechNews, Chey expects supply-demand tightness in the memory market to persist through 2030. ...

As thermal management emerges as a key challenge for HBM, SK hynix has unveiled its iHBM solution, which integrates cooling elements (ICEs) directly into the HBM package. The company plans to adopt the technology in next-generation products, including HBM5, according to its press release. Accordi...

While TSMC recently revealed that its upcoming A13 and A12 processes, both targeted for 2029, are not expected to require High-NA EUV lithography, ASML says the first chips produced using the technology may arrive soon. According to Reuters, ASML CEO Christophe Fouquet said the company expects to se...