[News] Samsung May Announce New Gwangju Advanced Packaging Base by End-June Amid Capacity Expansion

Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plans to build an advanced packaging plant in Gwangju. Samsung Electronics is expected to announce the investment as early as the end of this month at a meeting of major conglomerate leaders hosted by President Lee Jae-myung. The gathering is expected to be attended by SK Group Chairman Chey Tae-won and other business leaders.

As the report notes, the new facility would mark Samsung Electronics’ first packaging-base construction since the establishment of its Onyang Campus 35 years ago. It would also represent the company’s first major semiconductor production site groundbreaking since the launch of the Pyeongtaek Campus 11 years ago.

The move is widely viewed as an effort to expand production capacity by extending Samsung Electronics’ packaging network beyond its existing Chungcheong-region hubs, including Onyang in Asan and Cheonan, into the Honam region.

The decision to locate the facility in Gwangju also reflects broader infrastructure considerations, since Samsung selected the city amid concerns that electricity and water supplies in the Seoul metropolitan area are approaching their limits, the report adds.

Samsung Accelerates Packaging and Testing Investments

Samsung has also been expanding its advanced packaging footprint. According to New Daily, the company is scaling HBM back-end processing capacity at its Cheonan facility, targeting monthly capacities of 231,000 units for Thermal Compression Bonding (TCB) and 19,500 units for Hybrid Copper Bonding (HCB) by the end of 2026. The report adds that Samsung plans to transition its HBM stacking roadmap from TCB to HCB by 2029, underscoring its investment in next-generation packaging technologies.

Beyond its domestic expansion plans, Samsung Electronics is also moving ahead with overseas investments. According to Reuters, a proposal document shows that the company plans to invest 39 trillion dong (US$1.5 billion) in Vietnam to build a semiconductor testing facility. Construction has already begun at an industrial park about 60 kilometers north of Hanoi, with operations expected to commence in November 2027.

Advanced Packaging Expansion Extends Across Industry

Meanwhile, according to The Dong-A Ilbo, SK hynix is also reportedly considering establishing a semiconductor packaging production base in the Honam region, particularly in South Jeolla Province. However, SK hynix has already announced plans to invest 19 trillion won to build the P&T7 advanced packaging plant in Cheongju, North Chungcheong Province, and began construction in April this year.

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(Photo credit: Samsung)