[News] Samsung Unveils HBM5 Model for the First Time at Computex, Production Reportedly Seen Around 2028

Shortly after Samsung announced HBM4E sample shipment starts, the memory giant has made another progress by showcasing a mock-up of its 8th-generation High Bandwidth Memory (HBM5) for the first time, at Computex 2026 in Taipei on June 2, according to Chosun Biz and Mirror Media.

As highlighted by Chosun Biz, Samsung plans to use base dies manufactured on its in-house 2nm foundry process for HBM5. According to SeDaily, HBM5 is being prepared in 12-layer, 16-layer, and 20-layer DRAM stack configurations, with mass production expected around 2028, following HBM4E.

The report adds that Samsung is also developing its next-generation 1d DRAM process following the current 1c node, which could be applied starting from HBM5E.

Samsung Highlights HPB Tech as Key Thermal Solution for HBM5

Notably, Samsung’s HBM5 was showcased alongside Heat Path Block (HPB) technology, a thermal management design that improves heat dissipation by creating additional pathways for heat generated within HBM, Yonhap News reports. According to Samsung Electronics DS CTO Song Jae-hyuk, HPB has already been implemented and validated in HBM4E, with both reliability and stability fully verified, the report notes.

Mirror Media notes that the HBM5 architecture, which processes significantly larger data volumes at higher speeds, also leads to a sharp increase in internal heat generation. In particular, the D2D PHY (Die-to-Die Physical Layer), responsible for ultra-high-speed data transfer between HBM and external GPUs, is identified as one of the main heat sources within the base die.

The HPB technology has therefore been developed to address this challenge, the report adds, featuring an independent thermal path within the D2D PHY region that improves heat conduction and dissipation, reducing thermal resistance and enhancing system stability.

Last week, SK hynix unveiled its iHBM solution, which takes a similar approach by integrating cooling elements (ICEs) directly into the HBM package. According to the company press release, the technology is slated for deployment in next-generation products, including HBM5.

Read more

• [News] Samsung Starts Shipping Industry-First HBM4E Samples 3 Months After HBM4 Ramp; Performance Up 20%+
• [News] Samsung Reportedly Targets HBM4E Power Bottleneck with Design Overhaul, Cuts Defects 97%

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