While HBM4 is only just entering mass production this year, Samsung is already looking ahead. According to ETNews, speaking at NVIDIA GTC, Hwang Sang-jun, Vice President and Head of Memory Development at Samsung Electronics, said that the base die of HBM5 will adopt Samsung Foundry’s 2nm process,...

At the SK AI Summit 2025, SK hynix revealed a bold roadmap outlining its memory plans beyond 2029. According to Wccftech, the roadmap spans two phases: one for 2026 to 2028, and another for 2029 to 2031. Across both periods, the company plans to roll out a full lineup of HBM, DRAM, and NAND products...

As leading memory makers advance in HBM development, cooling technology is expected to become a key competitive factor once HBM5 enters commercialization—likely around 2029—according to Joungho Kim, a KAIST professor cited by The Elec. As noted in the report, Kim explains that while packaging...