While Samsung Electronics and SK hynix showcase HBM5 and HBM4E respectively at COMPUTEX Taipei, competition among memory giants is increasingly centering on thermal management. As reported by The Asia Business Daily, Samsung, SK hynix, and Micron are placing greater emphasis on cooling and power-eff...

Shortly after Samsung announced HBM4E sample shipment starts, the memory giant has made another progress by showcasing a mock-up of its 8th-generation High Bandwidth Memory (HBM5) for the first time, at Computex 2026 in Taipei on June 2, according to Chosun Biz and Mirror Media. As highlighted by...

As thermal management emerges as a key challenge for HBM, SK hynix has unveiled its iHBM solution, which integrates cooling elements (ICEs) directly into the HBM package. The company plans to adopt the technology in next-generation products, including HBM5, according to its press release. Accordi...

While HBM4 is only just entering mass production this year, Samsung is already looking ahead. According to ETNews, speaking at NVIDIA GTC, Hwang Sang-jun, Vice President and Head of Memory Development at Samsung Electronics, said that the base die of HBM5 will adopt Samsung Foundry’s 2nm process,...

At the SK AI Summit 2025, SK hynix revealed a bold roadmap outlining its memory plans beyond 2029. According to Wccftech, the roadmap spans two phases: one for 2026 to 2028, and another for 2029 to 2031. Across both periods, the company plans to roll out a full lineup of HBM, DRAM, and NAND products...