During the “SEMICON Korea 2024” event held recently in Seoul, Chun-hwan Kim, Vice President of global memory giant SK hynix, revealed that the company’s HBM3e has entered mass production, with plans to commence large-scale production of HBM4 in 2026.
According to a report from Business Korea, Chun-hwan Kim stated that SK hynix’s HBM3e memory is currently in mass production, with plans to initiate mass production of HBM4 in 2026.
He noted that with the advent of the AI computing era, generative AI is rapidly advancing, and the market is expected to grow at a rate of 35% annually. The rapid growth of the generative AI market requires a significant number of higher-performance AI chips to support it, further driving the demand for higher-bandwidth memory.
He further commented that the semiconductor industry would face intense survival competition this year to meet the increasing demand and customer needs for memory.
Kim also projected that the HBM market would grow by 40% by 2025, with SK hynix already strategically positioning itself in the market and planning to commence production of HBM4 in 2026.
Meanwhile, previous reports have also indicated that SK hynix expected to establish an advanced packaging facility in the state of Indiana, USA, to meet the demands of American companies, including NVIDIA.
Driven by the wave of AI advancement and demand from China, the Ministry of Trade, Industry and Energy of South Korea recently announced that South Korea’s semiconductor product exports experienced a rebound in 2024. In January, exports reached approximately USD 9.4 billion, marking a year-on-year increase of 56.2% and the largest growth in 73 months.
TrendForce has previously reported the progress of HBM3e, as outlined in the timeline below, which shows that SK hynix already provided its 8hi (24GB) samples to NVIDIA in mid-August.