TrendForce provides industry research reports on AI servers and data centers, covering GPU server shipments, CSP capex trends, and liquid cooling adoption.
Reports cover GPU and ASIC server shipment forecasts, hyperscaler capex, and data center build-out dynamics; in-depth tracking of HBM (HBM3e, HBM4) supply-demand balance, market pricing, and vendor competition; alongside analysis of liquid cooling penetration, co-packaged optics (CPO) mass production progress, server CPU demand shifts, and monthly Server DRAM and DIMM contract price updates.
NVIDIA expands its AI factory via integrated GPU, CPU, and LPU racks for training and inference, securing its market lead.
NVIDIA's strategic investment in Lumentum and Coherent secures critical InP laser and high‑power CW light‑source capacity, shifting supply‑chain focus from module assembly to upstream optical componen...
AI chips represent the core cost component of computing infrastructure. Recently, reports that Google’s TPU has been adopted by several leading companies have drawn attention to the possibility of mor...
CSPs' AI push fuels HBM shortages and price hikes. Strong conventional DRAM dilutes HBM share; base die production shifts to TSMC.
North American CSP CAPEX expansion drives dual demand for NVIDIA and custom chips. ODMs like Foxconn benefit from rack solutions and are expanding US/Mexico production. Power leaders Delta and LiteOn...
NVIDIA achieved record revenue driven by cloud AI and data center dominance. North American CSPs lead demand, establishing the GB series as mainstream and accelerating liquid cooling. However, HBM4 de...
Driven by robust AI demand and supply shortages, Korean makers raised quotes, triggering a sharp rise in Server DRAM contract prices. Supply growth lags behind demand despite capacity shifts. Conseque...
1. Google is consolidating its proprietary TPUs, Ironwood racks, 3D Torus topology, and the Apollo OCS optical backbone into a unified high-speed interconnect architecture. As a result, the focus of c...
As AIDC enters a high-power era, competition shifts to power and cooling infrastructure. Power architectures move toward HVDC, while cooling upgrades to liquid systems. Leading firms are integrating "...
Samsung currently leads HBM4 validation due to process improvements enhancing stability. SK hynix retains volume leadership despite re-sampling, while Micron trails slightly. Given robust AI demand an...
In 1Q26, strong Server and AI demand drove manufacturers to prioritize enterprise products, severely constraining consumer eMMC and UFS supply. Despite the seasonal lull, low inventories and shortage...
DRAM industry will focus on HBM capacity expansion, with Chinese suppliers limited by equipment restrictions; major players like Samsung, SK hynix, and Micron emphasize tech migration and AI applicati...
Looking ahead to 2026, major global CSPs are significantly increasing capital expenditures on AI infrastructure, focusing on high-density GPU racks and self-developed ASICs to optimize costs. North Am...
In 2026, the HBM market continues to grow, with SK hynix maintaining its lead and Samsung recovering significantly via HBM3e and HBM4 contributions. Micron also expands aggressively. While HBM3e domin...
Global Server Market – Trends and Outlook for 1Q26
