TrendForce provides industry research reports on AI servers and data centers, covering GPU server shipments, CSP capex trends, and liquid cooling adoption.
Reports cover GPU and ASIC server shipment forecasts, hyperscaler capex, and data center build-out dynamics; in-depth tracking of HBM (HBM3e, HBM4) supply-demand balance, market pricing, and vendor competition; alongside analysis of liquid cooling penetration, co-packaged optics (CPO) mass production progress, server CPU demand shifts, and monthly Server DRAM and DIMM contract price updates.
TrendForce raised its 2026 global server shipment forecast, driven by surging AI server demand from CSPs and enterprises, with momentum expected through 2027.
HBM remains irreplaceable in AI accelerators. HBM4 ramps, tight supply lifts prices, and ASIC demand diversifies the supplier base.
Server DRAM contract prices continue to rise due to supply deficits and depleted manufacturer inventories. Although premium pricing on high-capacity modules and shifts in processor configurations have...
AI demand tightens high-end MLCC supply, prompting agents to raise prices and strengthening supplier bargaining power. Geopolitical risks and inflation raise costs, curbing ODM leverage, with high-end...
As AI server platforms advance, power architectures evolve into multi-track systems, and cooling accelerates toward full liquid solutions. Delta and LiteOn capture cloud service provider and new platf...
Since 2H25, accelerated AI infrastructure buildouts by CSPs have surged HBM demand and crowded out conventional DRAM capacity, pushing the broader DRAM market into shortage. Constrained by annual pric...
NVIDIA FY1Q27 hit a record high with Data Center share above 92%，with GB/VR Rack rollout boosting liquid cooling and HBM supply chains.
2026 server market accelerates on AI demand; CSPs expand CAPEX while OEMs compete via rack-scale and liquid cooling solutions.
This report first explains why HBM plays a key role in the evolution of LLM and AIGC applications. It then examines the HBM upgrade roadmap and explores how heterogeneous memory integration strategies...
AI server demand surges on hyperscale and inference workloads, lifting CSP rack-scale buildout amid grid constraints.
As NVIDIA and ASIC platforms expand, AI data center power and liquid cooling capacities face tightening supplies. Chinese firms Megmeet and Honor have successfully entered global supply chains, achiev...
The 2026 Micro LED Report (to be published at the end of September 2026) covers trends in large-sized displays, automotive displays, wearable displays, head-mounted displays, optical interconnect appl...
The three major HBM suppliers highlighted HBM4 mass production and HBM4e development, as competition shifts toward pricing power and next-generation specs. Suppliers also remain positive on long-term...
CSP Capex fuels AI server growth; GPU and ASIC engines drive market upgrades as liquid cooling adoption accelerates.
AI server market expands robustly in 2026 amid hyperscaler capex, NVIDIA racks, and tight HBM-CoWoS supply chains.
