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HBM Market Bulletin - May 13, 2026
Last Modified
2026-05-13
Update Frequency
Monthly
Format
The three major HBM suppliers highlighted HBM4 mass production and HBM4e development, as competition shifts toward pricing power and next-generation specs. Suppliers also remain positive on long-term HBM pricing despite stronger conventional DRAM profitability.
Key Highlights
- HBM4: Suppliers advance ramp; Samsung secures pricing premium.
- HBM4e: 1c/1gamma nm nodes, 2H26 sampling, 2027 mass production.
- Margins: Despite stronger conventional DRAM profitability, suppliers remain positive on long-term HBM pricing.
- Architecture: LPU complements GPU, sustaining HBM demand.
- Capacity: Micron is advancing its Singapore packaging and Taichung wafer fabs, while SK hynix’s M15x expansion remains focused on HBM capacity.
Table of Contents
- Introduction
- Micron (FY2Q26, ending February 2026)
- SK hynix (1Q26)
- Samsung (1Q26)
- HBM3e & HBM4 Roadmap
<Total Pages: 3>
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