Research Reports

HBM Market Bulletin - May 13, 2026

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Last Modified

2026-05-13

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Update Frequency

Monthly

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Format

PDF



The three major HBM suppliers highlighted HBM4 mass production and HBM4e development, as competition shifts toward pricing power and next-generation specs. Suppliers also remain positive on long-term HBM pricing despite stronger conventional DRAM profitability.

Key Highlights

  • HBM4: Suppliers advance ramp; Samsung secures pricing premium.
  • HBM4e: 1c/1gamma nm nodes, 2H26 sampling, 2027 mass production.
  • Margins: Despite stronger conventional DRAM profitability, suppliers remain positive on long-term HBM pricing.
  • Architecture: LPU complements GPU, sustaining HBM demand.
  • Capacity: Micron is advancing its Singapore packaging and Taichung wafer fabs, while SK hynix’s M15x expansion remains focused on HBM capacity.

Table of Contents

  1. Introduction
  2. Micron (FY2Q26, ending February 2026)
  3. SK hynix (1Q26)
  4. Samsung (1Q26)
    • HBM3e & HBM4 Roadmap

<Total Pages: 3>

HBM3e & HBM4 Roadmap


Category: AI/HBM/Server




USD

25,000

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