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Global Notebook Shipments on the Rebound, Predicted to Surge 15.7% in 2Q23, Says TrendForce

4 July 2023

TrendForce has predicted a noticeable recovery in the global notebook market for 2Q23. Shipments are projected to hit 40.45 million units—a QoQ increase of 15.7%.

Chinese Car Brands Aggressively Expanding Overseas, Projected to Penetrate 9% of Western Europe’s NEV Market by 2023, Says TrendForce

30 June 2023

While gasoline cars still dominate exports, the tides are turning rapidly. NEVs accounted for a staggering 25% of Chinese auto exports 1Q23, establishing them as the focal point for future global expansion, according to TrendForce's report "An Analysis of the Overseas Expansion of Chinese Car Brands".

AI and HPC Demand Set to Boost HBM Volume by Almost 60% in 2023, Says TrendForce

28 June 2023

TrendForce forecasts that global demand for HBM will experience almost 60% growth annually in 2023, reaching 290 million GB, with a further 30% growth in 2024.

Surge in Panel Prices Spurs Brands to Stock Up Early, Leading to a 2% YoY Increase in Q2 Global TV Shipments, Says TrendForce

27 June 2023

TrendForce’s latest forecast predicts global TV shipments for 2Q23 will reach 46.63 million units—a 7.5% increase QoQ, a 2% growth YoY. The uptick in shipments is primarily due to strong stockpiling momentum from Chinese brands for the 618 e-commerce shopping festival.

Major CSPs Aggressively Constructing AI Servers and Boosting Demand for AI Chips and HBM, Advanced Packaging Capacity Forecasted to Surge 30~40% by 2024, Says TrendForce

21 June 2023

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia’s A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3.


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