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TrendForce highlights in its latest report that memory suppliers are boosting their production capacity in response to escalating orders from NVIDIA and CSPs for their in-house designed chips. These efforts include the expansion of TSV production lines to increase HBM output. Forecasts based on current production plans from suppliers indicate a remarkable 105% annual increase in HBM bit supply by 2024.
In July, EV battery prices in China demonstrated stability, with lithium salt prices registering a marginal decline. The prices of EV square ternary cells, LFP cells, and pouch ternary power cells in July remained relatively consistent with the prior month, positioned at CNY 0.73/Wh, 0.65/Wh, and 0.78/Wh, respectively. This trend comes amid relatively muted demand in the EV sector, according to TrendForce research.
TrendForce reports that the HBM (High Bandwidth Memory) market's dominant product for 2023 is HBM2e, employed by the NVIDIA A100/A800, AMD MI200, and most CSPs' (Cloud Service Providers) self-developed accelerator chips. As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year.
TrendForce predicts that the shipment quantity for automotive panels will cross the 200 million mark in 2023, reaching an estimated 205 million units—a 5.1% YoY growth.
TrendForce’s latest report on OLED technology and the market indicates that OLED panels will secure more than 50% market share in the smartphone industry by 2023.
