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TrendForce reports that the HBM (High Bandwidth Memory) market's dominant product for 2023 is HBM2e, employed by the NVIDIA A100/A800, AMD MI200, and most CSPs' (Cloud Service Providers) self-developed accelerator chips. As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year.
TrendForce predicts that the shipment quantity for automotive panels will cross the 200 million mark in 2023, reaching an estimated 205 million units—a 5.1% YoY growth.
TrendForce’s latest report on OLED technology and the market indicates that OLED panels will secure more than 50% market share in the smartphone industry by 2023.
TrendForce’s global automotive PCB market outlook report indicates that as over half of the PCB industry's end-use applications are in consumer electronics, the economic downturn has had a more pronounced impact on the PCB industry compared to other components, especially when end-market demand has yet to show a significant recovery.
TrendForce reports that MLCC suppliers are also experiencing a resurgence, with their monthly average BB ratio—a key market indicator—rising from 0.84 in April to 0.91 in early July. In tandem, total shipment volume saw a remarkable 12% growth, climbing from 345 billion units in March to 389 billion units in June.
