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Apple has sparked considerable discussions in the market after rumors surfaced that the company’s new 12.9-inch iPad Pro, to be released in 2021, may be equipped with Mini LED backlight technology. According to the newest investigations by the LEDinside research division of TrendForce, the manufacturing cost of Mini LED backlight displays is currently higher than that of traditional LCD and OLED displays. However, as manufacturers continue to make improvements in process technology and yield rate, the cost of Mini LED backlight displays is expected to undergo 15-20% YoY decreases and to potentially be lower than the cost of OLED displays by 2022, making Mini LED a cost-competitive option in the market. Not only will Apple integrate Mini LED backlight technology into its product lineups other than the iPad Pro, but other leading brands will also adopt Mini LED for their own products.
According to the latest investigations from the DRAMeXchange research division of TrendForce, both NVIDIA and AMD are planning to release new GPUs in 3Q20, and both Microsoft and Sony are expected to release new gaming consoles in 4Q20. Since all of these products will be equipped with high-density GDDR6 memory, their releases are expected to create a wave of demand for Graphics DRAM, in turn propping up its prices relative to other DRAM applications.
Regarding the impact on the wafer foundry industry from the latest specifications publicly announced by the Bureau of Industry and Security on May 15th, the latest analysis of DRAMeXchange from TrendForce has pointed out that despite the extra interpretation room for the relevant regulations, the known specifications state that additional volume of wafer orders after May 15th will require approval. In addition, the US has not ruled out the possibility in enhancing the normative intensity on Huawei or overall Chinese brands, thus the subsequent impact on wafer foundries may not be optimistic.
According to the latest investigations by the DRAMeXchange research division of TrendForce, the Bureau of Industry and Security of the U.S. Department of Commerce announced an expansion of the trade restrictions against the Chinese technology giant Huawei on May 15. The new rules, once implemented, will compel all foreign semiconductor manufacturers that use U.S.-made equipment to obtain a special license from the U.S. government in order to supply chips to Huawei and its subsidiaries or affiliates such as HiSilicon. While these rules are subject to further interpretation, TrendForce’s investigation finds that their effect on Huawei’s procurement of memory components (both DRAM and NAND Flash) is limited for now, with both DRAM and NAND Flash suppliers able to continue their shipments to Huawei. Worth noting, however, is the fact that the U.S. government will keep tightening its oversight on Huawei and Chinese technology enterprises on the whole. Therefore, further observations are needed to determine how much of an impact the enforcement of future restrictions will have on the ability of memory suppliers to sell their products and on the overall demand of the memory market going forward.
TSMC announced on May 15 that it will construct a new 12-inch wafer fab specializing in advanced process nodes in Arizona. The fab is expected to break ground in 2021 and enter mass production in 2024. TSMC will be manufacturing semiconductor chips with 5nm process technology, at a capacity of 20k wafer starts per month. Funding for the project is expected to reach about US$12 billion, to be invested across nine years starting in 2021. The DRAMeXchange research division of TrendForce estimates annual CAPEX for the project to be about $1.3 billion on average. Given that TSMC’s annual CAPEX for 2019 and 2020 is about $15 billion on average, the Arizona project would account for less than 10% of TSMC’s overall CAPEX.
