Recent reports that Apple and Qualcomm are recruiting engineers with EMIB (Embedded Multi-die Interconnect Bridge) expertise suggest Intel’s packaging technology is regaining momentum—helped in part by the tight squeeze on TSMC’s capacity. According to the Commercial Times, the shift indicates...

With speculation mounting that former TSMC SVP Wei-Jen Lo may have taken key materials to Intel, the company’s CEO Lip-Bu Tan has spoken out in response. According to Bloomberg, Tan describes the claims as rumor and speculation, stressing that the company respects intellectual property. As the ...

Construction of TSMC’s European fab is advancing. According to Commercial Times, sources say the company’s new Dresden facility has entered its main structural construction phase and is expected to move into fab-system installation and equipment move-in during the second half of 2026. The plant ...

Fresh off a 2nm data leak involving its engineers in August, TSMC is now facing an even bigger headache: rumors that former Senior VP Wei-Jen Lo—who reportedly joined Intel recently after retiring in July—had subordinates brief him and photocopy sensitive sub-2nm process materials before he left...

Amid rumors that former TSMC Senior VP Wei-Jen Lo might join Intel in the sub-2nm race, Liberty Times reports he returned to Team Blue in late October as VP of R&D, shocking the semiconductor industry. The report, citing industry sources, also claims that before retiring in July, Lo allegedly us...