Subject


TSMC


2023-08-21

[News] Speculations of TSMC Considering Third Fiscal Forecast Downgrade

According to Taiwan's Commercial Times, TSMC continues to face challenges from ongoing price undercutting and competitive bidding in mature semiconductor manufacturing processes. Concerns arise about the company's ability to offset these challenges with AI-related orders. Reports from the market sug...

2023-08-17

Weak Demand Pressures TSMC, Samsung, Dongbu HiTek 8-inch Foundry Prices

In recent market speculations, TSMC is rumored to have reduced its 8-inch wafer manufacturing quotes by as much as 30%, with subsequent reports suggesting that South Korean wafer foundries are following suit in lowering 8-inch wafer production prices. According to TrendForce's channel check, TSMC...

2023-08-17

[News] TSMC’s N3 and N4P Processes to Power Apple, Qualcomm, and MediaTek Chips

According to a report by Taiwan's Commercial Times, global smartphone brands are set to introduce a series of flagship-level new products. Following the introduction of Apple's A17 chip using TSMC's 3-nanometer process, Qualcomm's next-generation processor Snapdragon 8 Gen 3 and MediaTek's Dimensity...

2023-08-16

[News] CoWoS Production Surges at TSMC, UMC, Amkor, and ASE Hasten to Catch Up

According to a report by Taiwan's Commercial Times, JPMorgan's latest analysis reveals that AI demand will remain robust in the second half of the year. Encouragingly, TSMC's CoWoS capacity expansion progress is set to exceed expectations, with production capacity projected to reach 28,000 to 30,000...

2023-08-16

[News] Samsung Leads in Unveiling BSPDN Research; TSMC and Intel Speed Up Deployment

As per a report from Taiwan's TechNews," TSMC, Samsung, and Intel have been actively deploying Backside Power Delivery Network (BSPDN) strategies recently, and have announced plans to incorporate BSPDN into their logic chip development roadmap. For instance, Samsung intends to implement BSPDN techno...

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