Amid intensifying competition from Chinese players, Onsemi is reportedly under mounting pressure, with up to 300 job cuts planned at its Rožnov pod Radhoštěm plant in the Czech Republic, according to local media outlet e15. The move follows an earlier round of layoffs in 2025, when the US-based S...

Laser annealing adoption appears to be broadening. According to ETNews, the thermal treatment process is expanding beyond its traditional use in silicon (Si) wafers to silicon carbide (SiC), a material widely regarded as a leading candidate for next-generation power semiconductors. The report adds t...

Researchers at the Advanced Semiconductor Institute of the Hangzhou International Innovation Center at Zhejiang University recently announced a major breakthrough. A team led by Professor Xiaodong Pi and Researcher Rong Wang successfully fabricated an ultra-thick silicon carbide (SiC) epitaxial film...

Chinese equipment supplier Zhongwei Precision Instrument has announced a major advance in silicon carbide (SiC) substrate manufacturing, becoming the first to achieve mass production of 8-inch SiC laser lift-off technology with total material loss reduced to the 40μm range. The milestone breaks ...

Recently, Silai Semicon has completed the delivery of its third batch of mass-production laser lift-off (LLO) systems compatible with 12-inch silicon carbide (SiC) substrates. The company’s core R&D team originates from the laser science discipline at Huazhong University of Science and Tech...