As memory giants enter the final stage of HBM4 ramp-up ahead of NVIDIA’s Rubin launch, they are taking diverging approaches. According to Chosun Biz, Samsung is pushing to lift 1c DRAM yields for HBM4 toward 80%, while ZDNet reports that SK hynix is set to cut HBM4 volumes this year by 20–30%. ...

Following Micron’s completion of its acquisition of Powerchip Semiconductor Manufacturing Corp’s Tongluo P5 fab in March, the Taiwanese chipmaker provided further operational updates. According to Central News Agency, PSMC said at its annual general meeting on April 10 that first-quarter operati...

Samsung has reportedly resolved a key technical challenge in its SOCAMM2 design. According to ETNews, citing sources, the company has overcome the “warpage” issue, a major hurdle ahead of mass production of its next-generation AI server memory module, SOCAMM2 (System on Chip Advanced Memory Modu...

Please note that this article cites information from ETNews and Global Economic. Micron is reportedly making the industry’s first attempt to stack graphics DRAM (GDDR). According to ETNews, sources indicate that the company has begun developing a new product that vertically stacks GDDR. Micron...

Please note that this article cites information from Nikkei, 47 News, and CAFE Digital. While Micron has just completed its acquisition of a Tongluo fab from Taiwan-based PSMC, it may already be scouting its next target amid an aggressive expansion push. According to Nikkei, Japan Display Inc. (JDI...