With Samsung and SK hynix already entrenched in the high-capacity GDDR7 race, Micron is now the latest heavyweight to enter the arena. According to listings spotted on Micron’s official website and cited by Wccftech, the company has begun rolling out 24Gb (3GB) GDDR7 modules, rated at both 28 GT/s...

As NVIDIA accelerates adoption of SOCAMM2 (Small Outline Compression Attached Memory Module 2), competition among memory heavyweights is intensifying. Following Micron’s shipment of 256GB SOCAMM2 samples in early March, SK hynix announced on April 20 that it has kicked off mass production of 192GB...

As memory giants enter the final stage of HBM4 ramp-up ahead of NVIDIA’s Rubin launch, they are taking diverging approaches. According to Chosun Biz, Samsung is pushing to lift 1c DRAM yields for HBM4 toward 80%, while ZDNet reports that SK hynix is set to cut HBM4 volumes this year by 20–30%. ...

Following Micron’s completion of its acquisition of Powerchip Semiconductor Manufacturing Corp’s Tongluo P5 fab in March, the Taiwanese chipmaker provided further operational updates. According to Central News Agency, PSMC said at its annual general meeting on April 10 that first-quarter operati...

Samsung has reportedly resolved a key technical challenge in its SOCAMM2 design. According to ETNews, citing sources, the company has overcome the “warpage” issue, a major hurdle ahead of mass production of its next-generation AI server memory module, SOCAMM2 (System on Chip Advanced Memory Modu...