On March 11, Tiancheng Semiconductor announced that it had successfully developed a 14-inch silicon carbide (SiC) single crystal using self-developed equipment, with an effective thickness of 30 mm. The breakthrough marks China’s transition in large-sized SiC materials—from the “12-inch adopti...

As a critically important III-V compound semiconductor, indium phosphide (InP) has been widely used in cutting-edge technology fields such as optical communications, quantum-dot televisions, and space photovoltaics, thanks to its favorable bandgap, exceptionally high optoelectronic efficiency, and e...

China’s semiconductor push is gaining momentum, with the country now reportedly setting its sights on key chip materials, including photoresist. According to South China Morning Post, domestic supplier Xuzhou B&C Chemical aims to mass-produce several core photoresist materials for advanced nod...

How close could China come to Western technology in AI? According to Chosun Daily, Professor Kwon Seok-joon of Sungkyunkwan University’s Department of Semiconductor Convergence Engineering said that a “Chinese ASML” could emerge within a decade. As the report notes, Kwon said China is accel...

According to official sources from Shanghai’s Songjiang District, Nixi Semiconductor Technology (Shanghai) Co., Ltd., located in the Songjiang Comprehensive Bonded Zone, has officially completed the world’s first 35-micron ultra-thin wafer process and packaging & testing production line for ...