With Galaxy S26 slated for release in 2026, Samsung’s MX Division, which oversees smartphone production, is grappling with sharply rising costs amid the ongoing “memory super-cycle,” while the company’s Device Solutions (DS) Division remains firmly focused on profitability. According to Seda...

Earlier in July, Intel announced plans to consolidate its chip packaging operations in Costa Rica with facilities in Vietnam and Malaysia amid operational challenges. However, facing surging demand for chip packaging, the company is now set to inject an additional RM860 million ($208 million) into M...

With DRAM prices climbing sharply and supply still constrained, Samsung and SK hynix are prioritizing profitability. According to Hankyung, the two companies—together commanding roughly 70% of the DRAM market—signaled caution toward aggressive capacity expansion during recent IR meetings with ma...

Micron Technology has announced plans to invest JPY 1.5 trillion (approximately USD 9.6 billion) to build a new factory dedicated to high-bandwidth memory (HBM) chip production in Hiroshima, Japan. The facility will be located within Micron’s existing Hiroshima site, with construction scheduled to...

With AI compute demands soaring, silicon photonics is emerging as a next-generation technology poised to reshape the landscape. According to Hankyung, sources say that Samsung Electronics’ Device Solutions (DS) Division has designated the technology as a future strategic priority and begun recrui...