While South Korean memory giants Samsung Electronics and SK hynix saw their sales in China double in the first half of this year, the country as a whole seems to heavily rely on China for essential semiconductor raw materials as well, with silicon, germanium, gallium and indium seeing the largest increase, according to a report by the Korea Eximbank Overseas Economic Research Institute on September 24 cited by Business Korea.

Despite the efforts to diversify supply chains, the report highlights the growing reliance of South Korea on China for critical semiconductor raw materials. For instance, the importance of silicon, a vital component in silicon wafer production, has been increasing, as the country’s reliance on China for the ingredient rose from 68.8% to 75.4% in 2022, the report states.

Meanwhile, South Korea’s reliance on rare earths, which are used in semiconductor abrasives, is also said to be on the rise, the report notes. The reliance on tungsten, crucial for semiconductor metal wiring, experienced a slight increase as well.

It is worth noting that since August of last year, the Chinese government has imposed export restrictions on critical minerals, including germanium and gallium, as a counteract to U.S. export sanctions. According to the U.S. Geological Survey, China produces 98% of the world’s gallium and 60% of germanium.

Even before the sanction, there is a significant rise in South Korea’s dependence on China for these critical minerals. Business Korea notes that the country’s dependence on germanium, which is frequently used in next-gen compound semiconductors, surged by 17.4 percentage points to 74.3% in 2022.

In addition, reliance on gallium and indium increased by 20.5 percentage points to 46.7%, according to the report.

Under the scenario of China’s export restrictions on key minerals, which were implemented in August and December of last year, the local production by major Chinese companies has not significantly declined, the report notes.

For instance, Samsung’ NAND flash facility in Xi’an, China, has increased its share for the company’s total NAND capacity during the past few years, from 29% in 2021 to 37% in 2023, with expectations to reach 40% this year, according to the report.

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• [News] China’s Gallium and Germanium Export Restrictions Risk Chip Production Shortages
• [News] Chip War Escalates: China to Enforce State Ownership of All Rare Earth Materials in October

(Photo credit: Samsung)

According to TrendForce’s latest memory spot price trend report, regarding DRAM, reball DDR4 and DDR5 chips stripped from modules continue to flow into the spot market, adversely affecting the market outlook. As for NAND flash, contract prices for 3Q24 have exhibited signs of loosening. Some module houses are even selling their high-priced client SSD at a loss in order to rid inventory and reduce overall losses. Details are as follows:

DRAM Spot Price:

Reball DDR4 and DDR5 chips stripped from modules continue to flow into the spot market. Since prices of reball chips are lower compared with eTT chips and are in good quality, these products are adversely affecting the market outlook. Additionally, facing mounting pressure to sell, some module houses with higher inventory levels have started to cut prices, focusing primarily on clearing their stocks. Overall, the spot market is unlikely to see a significant improvement in the short term. The average spot price of mainstream chips (i.e., 1Gx8 2666MT/s) fell by 0.10% from US$1.964 last week to US$1.962 this week.

NAND Flash Spot Price:

Contract prices for 3Q24 that have exhibited signs of loosening, alongside the market’s reserved attitude on the future prospect, have prompted a rather large degree of truncation among retail and channel markets. Some module houses are even selling their high-priced client SSD at a loss in order to rid inventory and reduce overall losses. This phenomenon is likely to persist until 4Q24. Spot price of 512Gb TLC wafers dropped by 3.73% this week, arriving at US$2.710.

A month ago, Kioxia has reportedly submitted its initial public offering (IPO) application to the Tokyo Stock Exchange. However, as the memory market recently seems to be on a roller coaster ride, the latest report by Reuters notes that the Japanese memory chip maker has decided to cancel its plan to be listed in October.

Citing reports by Japanese media, another report by MoneyDJ indicates that Kioxia’s IPO is expected to be delayed until November or later.

Reuters points out that Kioxia has been aiming for a market valuation of JPY 1.5 trillion (roughly USD 10.39 billion). Nevertheless, the recent decline in shares of other listed memory companies, including Samsung, SK hynix and Micron, has made this target difficult to achieve.

According to Reuters, Bain Capital, which holds a 56% stake in Kioxia along with SK hynix, declined to comment. Kioxia, on the other hand, responded by saying that it is preparing to go public when the timing is right.

This is not the first time Kioxia abandoned its IPO plan. The memory giant had previously scheduled to be listed in 2020. However, due to continued market volatility and ongoing concerns about a second wave of COVID-19, the company gave up the plan in September, 2020.

A few days ago, Japan’s Tokyo Metro initiated the processes to launch its IPO next month. According to The Japan Times, Tokyo Metro aims to raise USD 2.25 billion, marking the country’s largest IPO in six years. Should Kioxia stick to its plan to kick off the IPO by 2024, the deal were to become the largest one of the year.

According to TrendForce, in the NAND Flash market, Kioxia ranked third in revenue in the second quarter of 2024, with a 13.8% market share, after Samsung (36.9%) and SK Group (22.1%).

Read more

• [News] Kioxia’s IPO Paves the Way for SK Hynix to Secure Funds for HBM Investment
• [News] Kioxia Filed for Listing, Reportedly Marking Japan’s Largest IPO of the Year

(Photo credit: Kioxia)

In 2024, the storage market is experiencing dynamic changes, with many positive developments, including rising contract prices, significant revenue growth for manufacturers, and multiple breakthroughs in technology. Amid this, major storage companies are gearing up for new challenges, especially as the NAND flash memory sector faces an impending shift.

How Far Have Major Companies Progressed with NAND Flash Technology?

This year, major storage manufacturers like Samsung, Micron, and SK Hynix have all made notable advancements in NAND flash technology.

In terms of NAND cell technology, Samsung has become the first in the industry to mass-produce its 9th generation V-NAND with QLC technology. On September 12, Samsung announced it had begun mass production of its 1Tb QLC (Quad-Level Cell) 9th generation vertical NAND (V-NAND), incorporating several groundbreaking technologies.

From a technological innovation perspective, Samsung’s 9th generation QLC V-NAND employs its unique channel hole etching technology to achieve the industry’s highest stack height with a dual-stack structure. Leveraging the expertise of TLC 9th generation V-NAND, the cell area and peripheral circuits are optimized, resulting in an 86% higher bit density than the previous generation.

Compared to earlier versions, the design of Samsung’s 9th generation QLC V-NAND improves data retention performance by about 20%, enhancing product reliability. Writing performance has doubled, and data input/output speeds have increased by 60%. Additionally, its low-power design reduces power consumption for both read and write operations by approximately 30% and 50%, respectively. This is achieved by sensing only the necessary bit lines (BL) to minimize power usage.

In terms of applications, Samsung plans to expand the use of the 9th generation QLC V-NAND from branded consumer products to mobile universal flash storage (UFS), PC, and server SSDs to meet the demands of customers, including cloud service providers.

Sung Hoi Hur, Executive Vice President and Head of Flash Product and Technology at Samsung Electronics, stated that as the enterprise SSD market grows rapidly and demand for AI applications increases, the company will continue to strengthen our leadership in the high-capacity, high-performance NAND flash market through 9th-generation QLC and TLC V-NAND.

However, at present, the mainstream products in the market are still TLC NAND flash memory particles. On August 6, SK Hynix’s Solidigm launched PCIe 5.0 data center SSDs, the D7-PS1010/1030 series, based on SK Hynix’s 176-layer 3D TLC NAND.

On September 11, SK Hynix announced the development of its high-performance SSD “PEB110 E1.S” for data centers, available in 2TB, 4TB, and 8TB versions. Currently undergoing validation with global data center customers, SK Hynix plans to begin mass production in the second quarter of next year.

On the other hand, Micron announced in late July that its SSD products featuring 9th generation (G9) TLC NAND technology had entered mass production, targeting personal devices, edge servers, enterprises, and cloud data centers. Micron’s G9 NAND achieves a data transfer rate 50% faster than current NAND technology used in SSDs. Its per-chip write and read bandwidths are 99% and 88% higher, respectively, than other NAND solutions. The Micron 2650 NVMe SSD, based on G9 NAND, achieves near-PCIe 4.0 performance levels, with a sequential read speed of up to 7,000 MB/s.

Micron also launched its new data center SSD, the 9550 NVMe SSD, featuring 232-layer 3D TLC NAND. It supports various AI workloads, offering a sequential read speed of 14.0 GB/s and a write speed of 10.0 GB/s—67% higher than competitive SSDs. The 9550 SSD’s random read speed reaches 3,300K IOPS, 35% higher than competitors, with random write speeds 33% higher.

The future of QLC SSDs is promising

Industry information indicates that NAND Flash, the core medium for data storage, is vital for SSD performance. Current SSDs use both TLC (Triple-Level Cell) and QLC flash.

In the AI era, there is a growing demand for storage, with SSDs playing a critical role. According to TrendForce, SSDs not only store model parameters during AI model training but also create checkpoints to save progress, making them crucial for high-speed data transfer and durability. As a result, customers primarily opt for 4TB/8TB TLC SSDs to meet the rigorous demands of AI training processes.

QLC SSDs, however, are gaining attention due to their higher storage density, which optimizes server space and reduces energy consumption. They can help large-scale data centers lower their total cost of ownership (TCO) while still meeting high-performance storage needs. Industry experts predict that as more data is generated in the form of videos and images, requiring larger storage capacities, TLC/QLC SSDs of 16TB or more will become the primary products for AI inference applications.

According to TrendForce, AI-related SSD procurement is expected to exceed 45 exabytes (EB) in 2024, with SSD demand in AI servers projected to grow by over 60% annually in the coming years. The share of AI SSDs within the NAND Flash market could rise from 5% in 2024 to 9% in 2025.

The Changing Landscape of the NAND Flash Market

On September 9, TrendForce’s latest research  indicates that in the second quarter of 2024, Samsung maintained its global leadership in the NAND Flash market with a 36.9% market share, up 0.2% from the previous quarter. SK Group followed with a 22.1% share, down 0.1%. Other key players include Kioxia (13.8%), Micron (11.8%), and Western Digital (10.5%).

In terms of revenue, Samsung, SK Group, Kioxia, Micron, and Western Digital all experienced quarter-on-quarter growth in NAND Flash revenues during the second quarter. Overall, NAND Flash revenue increased by 14% in the second quarter.

TrendForce indicates that as the inventory adjustments for server endpoints near completion and AI drives demand for high-capacity storage products, NAND Flash prices continued to rise in Q2 2024. However, due to high inventory levels at PC and smartphone manufacturers, NAND Flash bit shipments decreased by 1% quarter-over-quarter. Despite this, the average selling price increased by 15%, with total revenue reaching USD 16.796 billion, a 14.2% increase from the previous quarter.

Looking ahead to Q3, TrendForce expects that all NAND Flash suppliers have returned to profitability as of Q2 and plan to expand production capacity in Q3 to meet strong demand from AI and servers. However, due to weak market performance in the PC and smartphone sectors in the first half of the year, it is challenging to boost NAND Flash shipments. It is estimated that the average selling price of NAND Flash products will increase by 5% to 10% in Q3, while bit shipments may decrease by at least 5% due to a lack of peak season demand. Industry revenue is expected to remain roughly the same as the previous quarter.

(Photo credit: Samsung)

In 2024, the semiconductor industry has gradually emerged from its downturn and entered a phase of gradual recovery.

Observing the market situation, as downstream demand increases, a number of domestic semiconductor industry projects are accelerating.

Recently, more than 30 semiconductor-related projects have entered the stages of signing contracts, construction, topping-out, and production etc.

These projects span areas such as EDA, AI, advanced packaging, materials, equipment, third-generation semiconductors, chip design, CMOS sensors, and memory, involving companies like Huahong, Semitronix, YASC, Skyverse, Hoshine, Smartsens, Sanan Semiconductor, and CFMEE etc.

Conclusion

The industry has revealed that from this year’s market situation, the revenue of companies in the middle and upper reaches of the integrated circuit industry has generally improved, AI has become an important driving force for revenue growth, and the demand for acceleration chips such as GPU/HBM has increased. Some sub-sectors such as advanced packaging and equipment/materials related to the industrial chain have also benefited.

At the same time, as new energy vehicles drive the popularity of third-generation semiconductor materials, power devices such as silicon carbide are in high demand.

According to TrendForce, SiC is still showing an accelerated penetration trend in application markets such as automobiles and renewable energy where power density and efficiency are extremelyimportant.

The overall market demand will maintain a growth trend in the next few years, and it is estimated that the global SiC Power Device market size is expected to reach US$9.17 billion in 2028.

(Photo credit: Huahong)