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IC Manufacturing, Package&Test


2025-07-17

[News] ASML Confirms First High-NA EUV EXE:5200 Shipment, Reportedly Prepping for Intel’s 14A in 2027

IC Manufacturing, Package&Test

Despite warning that geopolitical risks could stall revenue growth in 2026, ASML still expects strong demand for both EUV and DUV tools this year. In its latest earnings call, the Dutch chipmaking equipment giant announced it has shipped the first EXE:5200 — a next-gen High-NA EUV system geared fo...

2025-07-16

[News] Ahead of TSMC Earnings: 10 Brokers Weigh in on Q3 Outlook, Currency Pressures, Capex Plans & More

IC Manufacturing, Package&Test

With TSMC’s earnings call just around the corner (July 17th), foreign and local brokers are lining up with key predictions. While the foundry giant’s Q2 revenue came in strong at $31.9 billion (NT$ 933.80 billion), surpassing guidance of $28.4–29.2 billion, analysts now expect Q3 sales to be r...

2025-07-14

[News] Intel on the Move: Nova Lake Reportedly Tapes Out on TSMC’s 2nm, with 18A Yields Gaining Speed

IC Manufacturing, Package&Test

Despite challenges from massive layoffs, Intel is showing promising progress with its next-gen flagship processor and 18A yields. According to TechPowerUp and SemiAccurate, Intel’s “Nova Lake-S” client CPU has reportedly taped out at TSMC’s 2nm fab in Taiwan. The reports reveal Intel tape...

2025-07-14

[News] Stronger Taiwan Dollar Weighs on TSMC’s Q3 Outlook: 5 Key Questions Before July 17 Earnings Call

IC Manufacturing, Package&Test

With TSMC’s earnings call scheduled for Thursday (July 17), all eyes are on the impact of the stronger Taiwan dollar, capex plans, and progress in advanced processes and packaging. However, Economic Daily News and Commercial Times point to a cautious Q3 outlook, factoring in currency headwinds. An...

2025-07-14

[News] China’s Final 12-Inch Fab AMS Collapses—Another Casualty in Ongoing Chip Project Failures

IC Manufacturing, Package&Test

Jiangsu Advanced Memory Semiconductor (AMS) has issued an announcement officially declaring the failure of its restructuring plan. This not only marks the final collapse of China’s last 12-inch wafer fab project, but also serves as a typical example of the wave of unfinished tech ventures in the c...

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