Amid China’s push to consolidate its semiconductor industry and strengthen chip self-sufficiency, AMEC—the country’s leading domestic supplier of etching and thin-film deposition tools—announced on December 18 plans to acquire a controlling stake in Sizone Technology, according to chinastart...

Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, citing Weibo tipster Fixed Focus Digital, Apple may shift from InFO (Integrated Fan-Out) to WMCM (Wafer-level Multi-Chip Module) packaging for its A20...

As SEMICON Japan opens today (December 17), Nikkei reports that semiconductor heavyweights—including NVIDIA, Intel, Micron, and TSMC—are set to participate. Yet the biggest buzz may center on Rapidus, the Japanese foundry expected to unveil the world’s first interposer prototype cut from a sin...

On December 11, the European Commission announced that it has approved EUR 623 million in German state aid for GlobalFoundries and X-FAB to support the construction of two new semiconductor manufacturing facilities in Germany. The aid consists of two grants, valued at EUR 495 million and EUR128 m...

Hygon and Sugon have canceled their planned merger, highlighting a growing wave of scrapped M&A deals in China’s A-share market. According to Chinese outlet Yicai, several A-share listed semiconductor companies have recently scrapped M&A and restructuring plans. On December 12, VeriSilicon...