As ultra-fast, high-volume data exchange becomes essential in the AI era, optical communication is becoming a key driver for upgrading data centers and AI infrastructure. According to Commercial Times, the rise of CPO (Co-Packaged Optics) switches is fueling demand for SerDes technology, which conve...

Intel is moving quickly as it trims non-core operations and shifts strategy. Just after reports of a planned spin-off of its Network and Edge Group (NEX), Bloomberg reveals that Ericsson is in talks to invest hundreds of millions in the unit. According to Bloomberg, under the discussion, Ericsson...

According to a report from TechNews, citing Notebookcheck, Tesla has recently signed a multi-billion-dollar AI6 chip production agreement with Samsung Foundry. Analysts cited in the report note that Tesla’s 2nm AI6 chips are expected to enter mass production in 2028, with peak output projected bet...

As part of its global cost-cutting drive, Intel is pulling back on new fab plans in Germany and Poland —and its long-delayed Ohio project has now been pushed beyond 2030-31, with no clear timeline in sight. So, what’s next for the Ohio site? According to The Columbus Dispatch and NBC4i, Intel no...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely. However, Info...