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IC Manufacturing, Package&Test


2025-11-04

[News] Chinese Chip Tool Maker AMEC Thin-Film Revenue Soars Nearly 1,300% YoY — What’s Behind It?

IC Manufacturing, Package&Test

China’s chip equipment makers are surging despite U.S. export curbs, with AMEC posting rapid growth. According to ijiwei, the company’s recently released third-quarter 2025 report shows strong results: revenue for the first three quarters reached 8.063 billion yuan, up 46.40% year on year. Notab...

2025-11-03

[News] TSMC Reportedly Flags 3–5% Price Hikes for Sub-5nm in 2026, Ripple Effects on Mature Nodes Expected

IC Manufacturing, Package&Test

With 2nm mass production just around the corner, speculation had been swirling that TSMC might charge 10–20% more for its next-gen node compared with 3nm. But with advanced-node capacity already stretched thin, industry sources say the foundry giant moved early—reportedly alerting clients as far...

2025-11-03

[News] China Makes Breakthrough in Chip Technology, Paving the Way for Lithography Advancements

IC Manufacturing, Package&Test

Lithography technology remains one of the core driving forces behind the continuous scaling of integrated circuit (IC) manufacturing. Recently, a research team led by Professor Peng Hailin from the College of Chemistry and Molecular Engineering at Peking University, together with collaborators, achi...

2025-10-31

[Insights] Multi-Billion Boost Powers China’s 2025 Chip Equipment Drive, Led by Piotech and AMEC

IC Manufacturing, Package&Test

One key aspect of China’s semiconductor sector is its massive investment drive. In 2025, TrendForce notes, national strategic priorities have focused on overcoming bottlenecks in advanced manufacturing processes and meeting the demands of high-volume production (HVM). According to industry sour...

2025-10-31

[News] SiC Shake-Up: Toshiba Drops China SICC Deal; Wolfspeed Posts Weak Results Amid Soft Demand

IC Manufacturing, Package&Test

Toshiba recently said that the memorandum of understanding (MOU) signed by its subsidiary, Toshiba Electronic Devices & Storage Corporation, with China’s SICC in August 2025, covering collaboration on silicon carbide (SiC) power semiconductor wafers, was terminated in September 2025 after furt...

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